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Chip Packaging 2.0 Provides Benefits to Board Designers - CircuiTree

Posted by Rick Austin on Thu, Mar 20, 2008 @ 03:20 PM
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Chip Packaging 2.0 Provides Benefits to Board Designers
"In Chip Packaging 2.0, we ask the question 'What if board designers were empowered to remap legacy package pinouts (without changing the performance of the silicon) to design optimum PCBs?'"
by Ken Gilleo, ET-Trends
Martin Hart, Mirror Semiconductor 
Posted: March 1, 2008

Tags: , , , ,

COMMENTS

There has been a ruling in the high court in London UK where the PCB designer who routed a 0.75mm BGA on a design was made liable for the failure of the product. 
 
An expert claimed that routing the ball stubs all in the same direction caused impedance and that was negligent routing. I would appreciate any comments you all may have as its possible this ruling could have an impact on all of your responsibilities 
 

posted @ Thursday, June 26, 2008 5:06 AM by Roger Benfield


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