Circuitblog - PCB design information and commentary for Managers, Engineers and Designers

Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules
DDR2 pushed memory clock frequencies to 400 MHz and data rates to 800 Mbps. DDR3 further pushes clock frequencies to 800 MHz, while DDR4 is up to 1.6 GHz. New packaging technologies such as die stacking and package-on-package (PoP) are being developed to accommodate the advances.
Dr. Frank Y. Yuan and Richard Crisp - Tessera Inc.
Posted: 1-Apr 2008